> A good idea is to build a thermal datalogger PCB with several
> thermocouples over it, obviously soldered with high-temperature
> solder, to record the profile in several points of the board. That's
> the way the oven 'tuning' it's done on industrial reflow linear ovens
> (Siemens SIPLACE ones, for example).

You're right and I forgot to mention that I did that initially too. If you
just use blobs of solder at various places, you can get idea of how
even the heat distribution is. However, I found that the
thermocouples were able to show time differences between the
inside and outside edges reaching temperature. It mattered.
In my case, about 70% of the oven tray area is useful.
Unless you change something substantial, you'd only need to do
that setup once.

Steve.

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