> At 07:19 PM 8/23/02 -0500, you wrote:
> >Too bad we can't pop open/disolve the package and
> >take a look at the die and *see* what the failure
> >mode was: punch-through, metal migtration, over
> >temp, manufacturing defect, bond wire ???

Boiling in concentrated sulphuric acid is an approved method to do just
that, I've been told.
Don't try that at home :-) !

        RM

--
http://www.piclist.com hint: The PICList is archived three different
ways.  See http://www.piclist.com/#archives for details.