At 07:19 PM 8/23/02 -0500, you wrote:
>Too bad we can't pop open/disolve the package and
>take a look at the die and *see* what the failure
>mode was: punch-through, metal migtration, over
>temp, manufacturing defect, bond wire ???

Or the middle lead just got itself opened (bad
wire bond, bad soldering to PCB). That the only
time I've seen a 78xx do that.

Best regards,

Spehro Pefhany --"it's the network..."            "The Journey is the reward"
speff@interlog.com             Info for manufacturers: http://www.trexon.com
Embedded software/hardware/analog  Info for designers:  http://www.speff.com
9/11 United we Stand

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