On Sat, 6 Jul 2002, Jinx wrote:

>> if you use a double or triple layer of transfers to give their
>> impressions in the epoxy some depth
>
>Just thinking, as I'm wont to do on special occassions - if
>you could put down and etch a reverse image on a PCB
>(perhaps one with a thick copper foil) then that would give
>you a flat epoxy face on the front with the lettering right way
>around, which hopefully you can ink. This is then your front
>face which you could mount behind the protective front plastic.
>This has the advantage of having the lettering as far forward
>as possible

You can thicken standard PCB by electroplating copper onto it then you can
use whatever you need (masking, photoresist) to mask and etch. The
vertical edges of the thicker features will not be straight.

Peter

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