http://www.powerdevices.com/isostrate2000.htm

Marcelo Y.

>-----Original Message-----
>From: pic microcontroller discussion list
>[mailto:PICLIST@MITVMA.MIT.EDU]On Behalf Of Pic Dude
>Sent: Wednesday, July 03, 2002 10:31 PM
>To: PICLIST@MITVMA.MIT.EDU
>Subject: [EE]: Heat-sink conductive material?
>
>
>Hey folks,
>
>I need to find some sort of material that I can place
>between a TO-220 device and a heatsink, that would
>"fill" an uneven gap.  I only know of mica sheets and
>thermal heat-sink grease (which I'm using), but I'm
>need something more "squishable" that will conform to
>the shape of the gap when squeezed.  Of course, if
>needs to promote thermal heat transfer, but does not
>matter if it conducts electricity or not.
>
>No, it's not easy to adjust it so that the surfaces
>are more parallel to each other.
>

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