Our company designs tools for downhole drilling where considerations are
made for a high shock/temperature/pressure environments. Here are some
construction methods that work for us.

* Strain-relief all wires connecting to the board with a small loop (run
through and extra hole drilled next to the connection), then harden each
connection with a two-part hardening compound (epoxy).
* Choose a method to strain-relief all high-mass components (e.g.
electrolytics) to the board. Most vunerable are points where the lead
connects to the board and where it leaves the component.
* Seal the board with a hard or soft potting compound, but apply a layer of
silicon conformal coating first. The conformal coating is thin and flexible
and prevents the potting from flowing underneath components, which may
expand during curing and actually 'pop' SMD's off the board. And be prepared
for your board to act unpredictably until the potting is fully cured.
* Secure the power source as you do the PCB -- especially if an interruption
in power sends the rocket off course. It's good to construct power packs
from solder-tab batteries, then to pot the batteries. This may be cost
prohibitive, but perhaps rechargeables can be used.
* If possible, soft pot (a clear potting with the consistency of a firm
Jello, as opposed to hard epoxy potting) the circuit and power source into
the housing cavity.



> > Are there any texts available on the design of electronics for high-G


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