Hi Wouter,

Good point, I had assumed that the board size would be quite small because
it would be the diameter of the projectile..

Are there any texts available on the design of electronics for high-G
environments? I'd be interested for my rocket timer project.. The board I'd
developing for that purpose will be mounted along the axis of acceleration
so flex isn't the problem, just the weight of the components.

I'm looking at a SOIC-28 '876 and a SMT resonator at present.. Also some
D2PAK (TO-252?) MOSFETs and mainly 0805 size resistors and caps.. Any hints?

Cheers,
Ash.

---
Ashley Roll
Digital Nemesis Pty Ltd
www.digitalnemesis.com
Mobile: +61 (0)417 705 718




> -----Original Message-----
> From: pic microcontroller discussion list
> [mailto:PICLIST@MITVMA.MIT.EDU]On Behalf Of wouter van ooijen
> & floortje
> hanneman
> Sent: Sunday, 2 June 2002 8:52 AM
> To: PICLIST@MITVMA.MIT.EDU
> Subject: Re: [EE] [OT]
>
>
> > If you were to arrange the PCB so the axis of acceleration
> goes through
> the
> > surface and "pushes" the components onto the board, I'd
> assume that you
> > wouldn't have any problems..
>
> I would not do that unless the PCB is very small: it might
> bent and hence
> (when the component is more stiff) the solder will crack.

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