In past years - eyelets (small rivets) were used.

Drill apporpriate hole, insert eyelet, crimp, solder.

We used those when prototyping low-Z med. power
stripline/microstrip RF board designs.

Jim

----- Original Message -----
From: "Stuart Meier" <stuartmeier@RYG1.FREESERVE.CO.UK>
To: <PICLIST@MITVMA.MIT.EDU>
Sent: Tuesday, February 19, 2002 5:26 AM
Subject: [EE]: vias in low vol double sided board production


> Having searched the archives without success, can anyone suggest a good
> way to do vias on smt double sided boards in low volume production ....
>
> Most of my stuff is single sided hand soldered, but I have a short run
> of two sided with half a dozen vias needed on each densely packed board
>
> For prototypes I just use scrap from led legs otherwise discarded, and
> soldered both sides, but something faster is needed with a few hundred
> vias to do.
>
> Stuart Meier
>

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