I am to produce a run of double sided SMT PCB's boards shortly.  I have assembled similar boards before, however I only had to deal with smaller components such as
0805's, 1206's  and SOT-23's on the underside, with all the larger SMD on the top, on the second pass.

My concern is for larger components on the underside falling off during the second pass through the oven.  Do I go for this specialist adhesive glue and glue-dot the larger
ones on?  Is there a rule of thumb as to which require adhesives and which don't?  I would welcome any comments and suggestions.

Regards

John Maud
Forth Electronics
Pietermatitzburg, South Africa

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