All, I have used a method similar to this except that I use solder wick to pick up the excess solder. I have done 348 pin ASICS with .25 mil lead pitch this way, and you couldn't tell them from machine placed and soldered parts. The trick is to use the correct size solder wick (Small - about .1" or less width) and just enough heat to pull the excess solder into the wick. Once this is done, pull the heat away quickly. Once you do this a few times and get used to it, you'll be able to solder and wick a part in just a minute or so. I have not tried the solder sucker method, but I too would agree that that would probably pull up nearly all the solder. Regards, Jim > Jim, > > > Thanks for your input, but i think that this technique of solder sucker > is not possible. The sucker will take all the solder, not only that > between the pins. > > > Best Regards, > > S.- > > ----- Original Message ----- > From: Jim > To: > Sent: Wednesday, December 19, 2001 11:40 AM > Subject: Re: [EE]: Manually soldering of a LQFP package.- > > > | I was able to solder some .5 mm pitch pins > | on a small HiRose connector by using regular > | solder - which will flood/solder multiple > | pins - then through the use of a solder > | sucker "remove" the excess. I had to be > | careful so as not to dislodge traces or > | accidently 'hit' the connector's pins while > | doing this (I used one of the hand-held > | spring-loaded trigger actuated solder > | suckers). > | > | I have no experience with solder paste and > | heat guns - so that technique may be a *more* > | suitable approach with as large a device > | as you have to solder in. > | > | Jim > | > | > | ----- Original Message ----- > | From: "Sebastian Garcia" > | To: > | Sent: Tuesday, December 18, 2001 6:24 PM > | Subject: [EE]: Manually soldering of a LQFP package.- > | > | > | > Hi there! > | > > | > > | > I will appreciate any help from an experienced lister about > techniques for > | > manual soldering this kind of chip. > | > I got experience on manual soldering of some types of SMD IC's > (using | > Chem-Wik rosin), but this one has a *very little* space > between pins. | > > | > The mechanical specs are: > | > > | > * Package: 144 pin (4x36 pin) LQFP (Low-profile QFP) > | > * Distance between center of pins: 0.5 mm. > | > * Pin width: 0.17 mm. > | > > | > > | > Probably it can be done using flux or solder paste, but i have no > detailed > | > idea about application of these techniques. > | > > | > And yes, the chip is available only with this package... > | > > | > > | > Best Regards, > | > > | > S.- > | > > | > | -- > | http://www.piclist.com hint: The list server can filter out subtopics > | (like ads or off topics) for you. See http://www.piclist.com/#topics > | > | > > -- > http://www.piclist.com hint: The list server can filter out subtopics > (like ads or off topics) for you. See http://www.piclist.com/#topics -- http://www.piclist.com#nomail Going offline? Don't AutoReply us! email listserv@mitvma.mit.edu with SET PICList DIGEST in the body