I was able to solder some .5 mm pitch pins
on a small HiRose connector by using regular
solder - which will flood/solder multiple
pins - then through the use of a solder
sucker "remove" the excess. I had to be
careful so as not to dislodge traces or
accidently 'hit' the connector's pins while
doing this (I used one of the hand-held
spring-loaded trigger actuated solder
suckers).

I have no experience with solder paste and
heat guns - so that technique may be a *more*
suitable approach with as large a device
as you have to solder in.

Jim


----- Original Message -----
From: "Sebastian Garcia" <sgarcia@FI.UBA.AR>
To: <PICLIST@MITVMA.MIT.EDU>
Sent: Tuesday, December 18, 2001 6:24 PM
Subject: [EE]: Manually soldering of a LQFP package.-


> Hi there!
>
>
> I will appreciate any help from an experienced lister about techniques for
> manual soldering this kind of chip.
> I got experience on manual soldering of some types of SMD IC's (using
> Chem-Wik rosin), but this one has a *very little* space between pins.
>
> The mechanical specs are:
>
> * Package: 144 pin (4x36 pin) LQFP (Low-profile QFP)
> * Distance between center of pins: 0.5 mm.
> * Pin width: 0.17 mm.
>
>
> Probably it can be done using flux or solder paste, but i have no detailed
> idea about application of these techniques.
>
> And yes, the chip is available only with this package...
>
>
> Best Regards,
>
> S.-
>

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