At 05:49 PM 12/17/01 -0500, Chris Loiacono wrote:
>I remember working with 'multi-wire' boards, which had layers of wiring
>buried in the resin similarly. Heavier wires needed to be buried deeper.
>Troubleshooting power 'layers' was a real bear, but it sure was a good thing
>the signal wire layers were nearer the surface. ECN's seemed to focus on
>them regularly.

That's a good "whatever happened to".. Like Space Food sticks, and fizzies!

I remember, the idea was that they just needed a netlist, no routing
information, and it was supposed to be faster and cheaper than prototype PCBs.

I suspect SMD is what happened to it.

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