At 10:15 AM 9/25/01 -0400, you wrote:
>I just received samples of Burr-Brown's ISO-124 low cost isolation
>amplifier from TI and found an unusual label attached to the normal static
bag:
>
>NOTICE!! PARTS ARE SUBJECT TO MOISTURE ABSORBTION. TAKE CARE TO PREVENT
>DAMAGE WHEN VAPOR OR IR SOLDERING. BAKE PRIOR TO SOLDERING TO REDUCE THE
>CHANCE OF DAMAGE.
>
>These are somewhat normal looking DIP packages, other than the fact that
>they don't have a full complement of legs.
>
>What's the deal? Is it the manufacturing process?

This has been a standard warning on all SMT packages subjected to IR
soldering for some time. You may have noticed dessicant and moisture-sealed
packages. Probably they just mark all the bags that way. I wouldn't worry
too much about it for normal soldering of through-hole parts under normal
conditions. The typical problem is that moisture migrates into an plastic
SMT package (they are NOT hermetic), and when IR soldering is performed
the resulting steam cracks the package or pops a chunk out of it.

Best regards,
Spehro Pefhany --"it's the network..."            "The Journey is the reward"
speff@interlog.com             Info for manufacturers: http://www.trexon.com
Embedded software/hardware/analog  Info for designers:  http://www.speff.com
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