> After years of development ;-) I've finally have my prototype robotic lawnmower > platform to a usable state. The most valuable lesson I learned is that > everything in the drive path must be metal, clamped, and use lock washers. > > Next on the agenda is motor control for the drive motors. Bob Blick's > discrete h-bridge is a natural for the project. But of course you end up > with 8 power transistors, plus another one for the cutting motor. > > I wanted to get some ideas of the best way to heatsink a bunch of power > transistors. If power dissipation is significant you want to really DESIGN your heat sinking system. How hard this is depends on how close to their limits you want to run your transistors. What power dissipation are you expecting? What devices are you using? (part numbers or required ratings). There are 3 thermal sections to the heat path. 1 - die to case 2 - case to heat sink 3 - heat sink to air If you have lots of metal for heatsink you will be able to get the HS down under 1 C/W (1 degree Celsius rise per watt dissipated). If you use electrically isolated packages they can be bolted directly to the HS thereby eliminating path 2 above BUT the inbuilt insulation has extra drop. look carefully at data sheets. This extra drop is typically around 1 C/W. Use grease. Mica washers require thermal grease because the washer is relatively rigid and does not make good content with transistor or heatsink. If the grease dries out with time you can get an increase in thermal resistance. AFAIR without looking it up you get around 1 C/W for the washer in a TO220 package. . Modern silicon rubber washers do not need grease and also run at about 1 C/W for a TO220 package. Mechanically larger packages (eg TO247) have a better C/W rating all things being equal. The transistor's internal thermal drop (1 above) varies markedly with devices, even in the same package. This can be well under 1 C/W up to several C/W so be careful. Also note that SOME manufacturers spec thermal resistance as W/C (inverse) so don't be fooled. You can get proprietary thermally conductive gasket materials with much better thermal resistances. These are often dear but may be worthwhile in extreme cases. Mounting to heatsinks with silicon rubber or similar is typically by spring clips. Ensure that adequate tension will ALWAYS be present across lifetime. Loss of tension with age can lead to higher thermal drop. Maximum clamping are specified by manufacturers but too low a force is liable to be more of a problem. Avoid point contact of clamping clips as this can lead to internal failures. If you can design the system so that the heatsink is at the same potential as the transistors tabs then no insulation is needed and direct mounting will give better thermal results. Use grease here! If the heatsink has a thinner portion between the transistor contact points and the main HS body or the heat path is mechanically long beware temperature rise across this section. You could consider fluid heat transfer or heat pipes but that is probably getting excessively complicated. Russell McMahon -- http://www.piclist.com hint: To leave the PICList mailto:piclist-unsubscribe-request@mitvma.mit.edu