Hi,

> > Besides I prefer to have infrared radiation directly to the
> > board and the ceramic material might kill it.
>
> And I prefer indirect heating using forced air (slow at 0.5-1.5 m/sec)
> which avoids parts of the board being cooked while the shiny solder stays
> relatively cold.

    That is the best way at most of the times but much harder to make
because that air has to be slow and "laminar" or the turbulence will cause
cold spots. I have tried to make something like that in a small oven and
gave up in a few days. Easy on a big oven but really hard on small ones,
specially if you want to solder both sides of the board at once. Infrared is
the next best thing and much more easyly done.

Best regards,
Alexandre Guimaraes
alexg@iis.com.br

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