> Thanx everyone for your help!
> It would benefit me to have a 12f508 on the market. I wouldnt have to
bother
> about UV erasing the thing and I would develop the code on the flash part
> and then use an OTP part for the final device. Or I could just emulate the
> code first, modify it, wack it on a 16f84, see if it works and then wack
the
> code on the OTP device. Hmmm I can hold my breath and wait/hope for a
12f508
> or I can do the latter!
>
> Wouter: Just for the sake of it (ie: killing time), I'll try converting it
> to a JW part tonight! If it works I'll put my entry in for the lotto! Will
> exposing the internals of the chip wreck it, as in exposure to air?
> The last method of yours is quite a good idea!

Chips are encapsulated to protect them from damage caused by the slow
infiltration of contaminants. If you manage to open up the chip without
physically damaging the lead frame, bonding wires or die it will probably
work, for a while at least.

Anybody's guess on the definition of 'a while'.

Bob Ammerman
RAm Systems
(contract development of high performance, high function, low-level
software)

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