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I have had to do this on occasion. One particular proto project was used
in the field for 3 days before it failed. The failure was a MAX3100 in a
uMAX package. Failure was attributed to heat stress during the mounting
process. Suffice to say I was extra careful the second time around...

BTW: I have poor eyesight and need to use a magnifier to do such work.
If i don't then i tend to burn the tip of my nose with the soldering
iron 8-)

Morgan Olsson wrote:
>
> I usually solder SMD IC into DIP sockets with turned sockets.
>
> I place the IC "in the air" about a centimeter above the socket.
>
> I put 0,4 or 0,5 mm wires in the sockets, and bend them to get in contact with the IC > pins from below.  Then it is easy to solder them to the pin ends.
>
> If it is SOP i let all wires in from below.
>
> If it is a MSOP/SSOP I bend every other pin upwards using a fine plier.  First i solder > all unbent pins to corresponding wires by the above method, then mount hte other wires > and solder to the up-bent pins, wires entering horisontally.
>
> The power pins I let pass the joint to th eIC, and solder decoupling cap above IC.  > Maybe some other components also, and pin-pin interconnections.  I usually end up > needing less pins on the DIP socket than are on the IC.
>
> Sometimes I dont use sockets on the protoboard, byt wires directly to the SMD IC placed > about a cm above the board.
>
> Works perfectly.
>
> /Morgan
>

Nino.
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| Antonio (Nino) L. Benci                            |
| Professional Officer / Electronic Services Manager |
| Department of Physics                              |
| Monash University                                  |
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