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I fully understand the IC manufacturers choice in their use of super
small IC packages, such as uMAX10 and 6 pin SOT23. BUT would it really
hurt them to provide DIP equivalents for prototyping work.

I am really pushed at times when requested to produce a prototype
circuit and the only variants available are SM devices in such
physically small packages. On most, if not all occasions, this requires
a costly printed PCB be made to accommodate these devices. The prototype
would function just as well on a VERO board or simple matrix board.

No i'm not designing to RF specs. Just custom data acquisition systems
for teaching & research labs...

Comments and views appreciated...

Nino.
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| Antonio (Nino) L. Benci                            |
| Professional Officer / Electronic Services Manager |
| Department of Physics                              |
| Monash University                                  |
| T: 61 3 9905 3649. F: 61 3 9905 3637               |
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