At 10:59 AM 10/17/00 -0700, you wrote:
>I got the part about precutting leads, but why fill the vias again?

It's not all that uncommon for there to be a micro-crack at the
interface between the plated hole barrel and the traces. Easy to
see when you section the PCB and look at it through a microscope,
difficult to inspect non-destructively.

Putting solder in the hole makes the vias more reliable because it
flows from top to bottom, not relying solely on the integrity of
the plating.

This used to be a very big problem with boards, it is much less
these days, but if you are paying $10,000 per pound to loft
something into space, putting it under the ocean or if someone's
life might depend on it, it seems like cheap insurance.

Best regards,

=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=
Spehro Pefhany --"it's the network..."            "The Journey is the reward"
speff@interlog.com             Info for manufacturers: http://www.trexon.com
Embedded software/hardware/analog  Info for designers:  http://www.speff.com
Contributions invited->The AVR-gcc FAQ is at: http://www.bluecollarlinux.com
=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=-=

--
http://www.piclist.com#nomail Going offline? Don't AutoReply us!
use mailto:listserv@mitvma.mit.edu?body=SET%20PICList%20DIGEST