When using DIP, instead of automatically plotting a board out for
through-pin, make it upside-down (or lay traces on the "top" side).
Bend IC legs out SMT-style, bend them under PLCC-style or cut the
legs short and just sit the IC on the tracks. In all cases make the bends
or cuts in the narrowest part of the leg so you can use thinner tracks.

Several plusses for me - saves W&T on drill bits, easier to follow
signal paths when you can see the pin a track is connected to and I
get to use some recycled SMT passive parts from scrap boards

Double-siding is a lot easier when you don't have to avoid pins from
the other side. A few pins can be left straight to go through the board
for power / logic connections

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A programmer is a device for turning coffee into software

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