Martin,

 I have had to solder some 380 pin TSOP devices with a .5mm lead
 pitch, and I have a technique for doing this that at first glance
 seems unimaginable, but in the end, works just fine and looks even
 better.   Here's how I do it.

 I put pen based low clean flux on all pads of the parts foorptint.
 I then tack solder the part to diagonal corners.  This is relatively
 easy.  I will tweak these two corners until I have it lined up.
 Once I've got it lined up like I want it, I then proceed to lay the
 soldering iron tip across 2-3 pins at a time and solder everything.
 This allows me to get solder on all pins and at the same time, keep
 heat rise down.  When you do this, you should wind up with just
 about every pin shorted to each adjacent pin.  Now, I take solder
 wick, and wick up the excess solder.  When I get done, you can't
 tell it wasn't put on by a machine.  The only precautions you need
 to look out for are to keep the heat to a mininum, don't dwell on
 pins too long, and use flux remover when done to tidy it all up.
 This technique has worked for me and I'm sure it'll work for you too.
 Let me know how you like it, good or bad.

                                              Regards,


                                                Jim



On Thu, 13 July 2000, Martin Hill wrote:

>
> I have been trying to get the Crystal CS5533 to work with a
> 16F876.  Looks really good from the spec but I can't get it to self
> calibrate properly.  If it worked properly it would be good.  This is
> four channel 16 bit with built in self and system calibration and
> programmable gain.  Only pain is that it's only available in TSSOP
> package with 0.65mm pin spacing which makes soldering by hand
> a bit of a pain for the prototype.
>
> Cheers
>
> Martin
>
> > Would someone recommend 12,14,16bit multi-channel ADC with SPI interface to
> > connect PIC16F877?
> >
> > albertgoodwill@yahoo.com
> >
> >
> >
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jim@jpes.com

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