Dave Johnson wrote:
>
> I'm working on a project where the target board is tiny, using surface
> mount parts (including the PIC in a TQFP). But of course I need to
> reprogram the PIC umpteen times during development. What's the usual
> strategy here? It's impractical to breadboard this project so that I
> could use a windowed part, but of course I don't want to throw away a PIC
> every time I need to fix a firmware bug, not to mention removing and
> replacing the part from the board.
>
> I suppose the ideal solution would be an ICE, but I can't afford it.
> Maybe some sort of adapter to use the windowed part?
>
> Any suggestions/strategies are appreciated.
>
> Dave Johnson


If you can tolerate the mass (that is, you don't have to
run the prototype in a rocket or something), solder leads
from a ZIF socket to the pads. When you've got it working,
hot glue the zif to the board.

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