The issue is NOT the life of the chips after manufacturing - the issue
is that if you let the chips absorb moisture, when you immerse them in
liquid solder they have a tendency to explode, this being what water does
when you heat it to 450 degrees.

The baking instructions are to be done just prior to soldering.

Ramtron isn't 'severely misrepresenting' it's product - any more than
by not mentioning that the chips won't work if you stick them in a reactor
or boil them in aqua regia or whatever.
This is pretty standard for all IC's that are to be immersion or reflow soldered
.
They're just being unusually conscientious by giving you the info to do the
baking, instead of letting you guess for yourself.

--
Anniepoo
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