On Thu, 12 Aug 1999 09:31:26 +0100, you wrote: >In article <4.1.19990811163601.009b99c0@pop.fast.net>, Andy Kunz > writes >> >>We are shipping a product which controls IRP separately from INDF in a '76. >> >>It works fine in our product. > >Andy, > >Thanks for that. Do you use an emulator of any sort? I am coming around >to thinking it must be a bug in the bondout, or possibly my emulator, >although I can't see how the emulator could influence things when it's >running at full speed. > >I have arranged my source to conditionally build with or without the >code to match IRP and RP1 depending on the target. The real silicon >SEEMS to be fine without the extra code. Not directly relevant but I know of at least one other case where the bondout chip used in a picmaster probe behaves differently to the 'real' silicon, so it's not unheard of.