>I plan on prototyping with some Atmel DataFlash parts this summer. They
>only come in SOIC and TSOP packages. Which is easier to socket for
>prototyping?

SOIC pins are on 0.050" spacing.  TSOP are on 0.020" spacing.  Which do
you think is easier?

In case even that's not obvious, I can say that I cut my teeth for quite
a while on SOIC before I would even have thought of trying to solder a
TSOP package.  Even now, several years later, I avoid TSOP packages if at
all possible.

Soldering TSOP's is not too horrendous the first time - you just need
lots of flux.  I literally bathe the pins in liquid flux, then rake the
iron across the pins.  Solder wick can be used to clean the occasional
bridge.  Reworking is another story.  You need the proper tools, steady
hands, patience, and some chips and boards you can afford to destroy.
And if you're thinking of using sockets, keep in mind they are MUCH
harder to solder to a board than are the chips.

For prototyping, I'd go with PLCC.  The sockets are cheap, while SOIC and
TSOP sockets are mucho denero.  PLCC sockets are available in
through-hole configurations, making soldering a trivial task.  The
packages are larger, but the strain on your sanity will be much smaller.

Hope this helps.


Don
dlburdette@juno.com