Kelly, I couldn't guarantee that I know what is happening here but I suspect that I could STOP it happening for very little effort, BIMBW * i Doesn't seem likely but - High dv/dt on FET switching can reflect into gate. Oscillation can occur on gate under "correct" conditions. The voltage here would need to be high enough to drive IC into latch up via 1K drive resistor. ii I don't know how long the cable is but significant energy *may* be able to be stored in the cable. What is it's capacitance. You are driving it directly (NO resistor from gate output. Is this within spec? (ie - depending on connection method there may effectively be capacitance to ground bypassing the FET gate resistor). iii Regardless of mechanism, the *cause* would *seem* to be energy from the cable getting into the gate's output. Faced with this problem I would. a) Strongly consider placing the 1K series resistor at the gate output rather than at the FET (isolates gate from direct capacitance) or split the resistor to eg 470r at each end of cable. At present the IC output is directly exposed to anything that *may* appear on the cable. b) Place Schottky catch diodes to ground and supply at the IC output. With 1K resistor and say 30ma capability (a very small Schottky (BAT85 etc?)) you can withstand 30 volt continuous above or below power supply rails without sinking ANY current in the ICs substrate diodes. As long as the problem is not from somewhere else (eg spikes via the Vcc rail) these steps would be very very (very ...) likely to prevent damage, regardless of the cause. With the amount of energy you have in the general vicinity I would want to be extremely certain that my power supply was not the source of problems BUT I would pick the above as most probable. regards Russell McMahon * BIMBW = But, I May Be Wrong :-) PS - if I had to "test" this situation rather than fixing it I would consider applying, to the IC output, capacitors of the value equivalent to that of the cable, charged to increasingly greater voltage until I replicated the fault (or couldn't). From: Kelly Schauf >To the forum: > >The problem I have does not involve a PIC; however, there appears to be >an abundance of knowledge in this forum regarding electronics based on >some of the messages I've read so far. > >Is there anyone out there in the forum that has experience with Design of >Experiments (Taguchi-type) in addition to their electronics >troubleshooting skills. I have been seeing repetitive problems with a >MM54C14J Hex Inverter (an old ceramic-style part) where the Vcc is >getting creamed. > >Because the explanation of the failure will be a bit too long to >adequately put into a message, the best place to get further details of >the failure type is to go to >http://web.gmtcom.com/~k3jsch/sixsigma/access.htm > >The problem occurs regardless of the following: > >1) Whether it has been in service for only a few hours or at least 8000 >hours. >2) Whether it is operating at a temperature of 55 degrees C or slightly >past 100 degrees C > >3) Whether it is operating in a 60Hz domestic unit or a 50Hz overseas unit. > >4) date code of IC > >Any suggestions, etc., are welcome. What I am trying to do is set up an >experiment at our production facility to inject noise, etc. into the >design as it is running. Factors I am looking at are : > >1) Levels of noise voltage to inject into the cable between the >microprocessor unit that this IC resides on and the gate firing board of >the SCR bridge that is directly mounted over the 3-phase, 6SCR bridge >that ultimately runs either the left track or right track motor. > >2) Brand name of chip. > >3) Whether or not modification to the shielded cable and/or its placement >in the circuit would make a difference. > > >Regards, > >Kelly Schauf >k3jsch@mail.gmtcom.com >