I agree, the chip might be defective. Where I used to work(we made DRAM's), packaged chips were subjected to much more severe thermal shock than what you had described. When we had failures, we normally traced it back to either fabrication or packaging problems. Regards, Bancherd(Mike) DeLong Nigel Goodwin wrote: > In message <012501be928b$c2427fc0$1d084ad4@StuartMeier>, Stuart Meier > writes > >Thanks for all the responses. I should have thought of thermal shock, and > >condensation. He seemed fine all covered in snow, death was during the warm > >up it appeared (either because of lag as the core of the PIC caught up with > >external temp, or the snow melting...) > > I would suspect the chip must have been faulty to have died in this way, > I've been squirting chips with freezer for years (while looking for > thermal intermittent faults), and good chips don't have any problems > with been turned into an iceberg :-). > -- > > Nigel. > > /--------------------------------------------------------------\ > | Nigel Goodwin | Internet : nigelg@lpilsley.demon.co.uk | > | Lower Pilsley | Web Page : http://www.lpilsley.demon.co.uk | > | Chesterfield | Official site for Shin Ki and New Spirit | > | England | Ju Jitsu | > \--------------------------------------------------------------/