> wire-wrap technology stays around for a few more years.  On a personal
> level, I can handle the size of components and pin spacing with this
> form of technology with no real problem but that surface mount stuff
> just feels like blobs of plastic with slightly rough edges.:-)  One

There exist test clips that can be clipped onto those popular 1.27mm
SOICs. On the upper end of the clip they have 2.54mm spacing for
cable connection. (Farnell, RS Components, etc)