On Wed, 11 Nov 1998 15:12:45 -0800, Mark Willis wrote:

>conducting bar of some other high heat transferring material (A friend &
>I joke about making IC's atop a Diamond layer, as it's a good heat
>conductor, he says.  If so, it's an expensive heat conductor!)

Dude this is no joke...  It's being done here at the University of Arkansas in t
he High Density Electronics Center (HiDEC).  They
make Multi-Chip-Modules and aparently heat is the real problem.  One of my frate
rnity brothers wrote a simulation program for the
laser they use to drill and cut the diamond.  It was his MS thesis.


--
Richard A. Smith                         Bitworks, Inc.
rsmith@bitworks.com               501.521.3908
Sr. Design Engineer        http://www.bitworks.com