At 10:12 AM 1/09/98 -0400, you wrote:
>I have encased short term underseas electronics in epoxy, so
>although it does have a hygroscopic number not suitable for
>long term dunkings, the question was about a suitable
>glue for such tasks as assembling sockets to perf board.
>The clear 5 min curing stuff is perfect for most applications
>where it is OK for the unset epoxy to run.  For non-sag, I would
>recommend another widely available epoxy paste product
>called PC-7.  Epoxys, especially the clear  5 minute runny
>ones *do* melt when you touch them with a solder iron tip,
>so I suppose the 70 degrees Dennis cited may be 70 degrees C.
> But again, in non critical, room temperature applications, you
>will not see the product start melting.  Epoxies are an excellent
>choice for electronic work.  Many components are encased with
>it, in fact.  For potting, as strange as this sounds, I choose a
>pourable epoxy that is filled with metal dust, called Liquid
>Steel by Devcon.  For low voltage applications, including 120V
>it has never shown any tendancy to conduct, although I would
>suspect that would change as you got into HV applications.
>

Try, using glass beads to fill the epoxy instead, they are cheeper.

Dennis




>John Shreffler
>