>Actually, the copper foil technique was developed precisely because it
>is easier than the heat transfer method, and produces vastly superior
>results.  It is very dificult for most people to get consistent
>results with the TEC sheets (and similar products), and the very fact
>that the toner is transferred twice limits the minimum reliable trace
>width.  This new method promises high quality prototype PCB's with a
>minimum of fuss.

That method might be better or worse, but
I've seldom had a problem with the toner transfer film.
Ocassionally I'll screw one up, but not too often. :-)

Never had a problem running a trace between IC pins, and
rarely have to do touch-up work.