>  We use a 250 deg.C bake to
    >test the retention of our EPROM cells.  If a wafer is subjected to a
    >450 deg.C bake, it will erase the chip without any light at all.

    Does this mean that we can subject OTP parts to 842 degrees F (450 C)
    and erase them?

Sure, except that if you do this with a finished chip instead of a wafer,
the package will burn and the leadwires (or their connecting "solder") will
melt.

 :-)
BillW